terça-feira, dezembro 5, 2023

Microelectromechanical system for in-situ quantitative testing of tension-compression asymmetry in nanostructures

This paper presents a novel on-chip microelectromechanical system (MEMS) that may notice in-situ quantitative mechanical testing of nanostructures underneath tension-compression capabilities. The system integrates stress and compression electrostatic actuators with reverse driving orientations in a assist system, enabling environment friendly dimension discount whereas retaining actuation capabilities. Mechanical properties of three sorts of nanostructures fabricated utilizing centered ion beam (FIB) methods have been investigated with the offered on-chip testing system. Outcomes declare that Pt nanopillars and C nanowires seem plastic deformation conduct underneath stress check, with common Younger’s moduli of 70.06 GPa and 58.32 GPa, respectively. Within the compression check, the Pt nanopillar exhibited in-plane buckling conduct with a yield energy of 912 MPa and Younger’s modulus of 68.81 GPa. The C nanowire displayed 3D twisting conduct with a most pressure of 25.47%, indicating distinctive flexibility. Furthermore, the uneven conduct of the C nanospring is revealed throughout 5 loading-unloading tension-compression deformation assessments. This on-chip MEMS system affords a promising resolution for mechanical testing of nanostructures, with potential purposes in nanotechnology analysis.

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